Defense & Aerospace 

PM’s main capabilities

Advanced Services for Military Manufacturing

Automated X-Ray Inspection (AXI)

Our AXI systems provide precise, non-destructive inspection of hidden solder joints and complex assemblies. This technology ensures the highest quality standards by identifying defects such as voids, solder bridges, and misalignments within multi-layered PCBs.

Flying Probe Testing

Our flying probe testing offers flexible, high-precision electrical testing without the need for custom fixtures. This method is ideal for prototypes and low-to-medium volume production, ensuring thorough verification of connectivity, component placement, and circuit integrity.

In-Circuit Testing (ICT)

Our ICT solutions deliver fast and reliable verification of assembled boards through comprehensive testing of components and circuitry. This capability is best suited for high-volume production, ensuring consistent quality and rapid defect detection.

Conformal Coating

We offer advanced conformal coating services to protect electronic assemblies from moisture, dust, chemicals, and temperature variations. This protective layer ensures long-term reliability and durability, especially in harsh environments, by preventing corrosion and electrical failures.

Components Bonding

Our components bonding services ensure secure attachment of electronic components to withstand extreme mechanical, thermal, and environmental stresses. Using advanced bonding techniques and materials, we guarantee durability and reliability in military-grade assemblies, meeting stringent quality and performance standards.

Vapor Phase Soldering

Our vapor phase soldering service offers precise and uniform soldering for complex assemblies. This process ensures consistent heat distribution, reduces void formation in solder joints, and eliminates the risk of overheating. It is ideal for soldering high-density and sensitive components with exceptional reliability.

Nitrogen Reflow Soldering

We provide nitrogen reflow soldering to enhance joint quality and reduce oxidation during the soldering process. This controlled environment improves wetting, minimizes solder defects, and ensures high-reliability solder joints, meeting the stringent requirements of military-grade manufacturing.

Class 3 IPC-A-610 Standard Assembly:
Expert assembly processes compliant with the highest industry standards for quality and reliability

CAPA and 8D Root Cause Analysis:
Comprehensive corrective and preventive action (CAPA) management and thorough 8D root cause analysis to ensure product reliability

Strategic Manufacturing Planning:
Tailored manufacturing plans that align with market standards and meet customer requirements, including DFT (Design for Test) and DFM (Design for Manufacturing)

Advanced Circuit Board Assembly:
Precision assembly for rigid and flexible circuit boards.

Flexible Component Assembly:
Specialized assembly on flexible circuits, including FCOB (Flexible Chip-On-Board) and COB (Chip-On-Board).

RoHS-Compliant Production Lines:
Environmentally-friendly production lines that adhere to RoHS (Restriction of Hazardous Substances) standards.

Power Supply Integration:
Adjustment and integration of power supplies with various electronic products.

Comprehensive Packaging Solutions:
Secure and efficient packaging of finished products to ensure safe delivery

End-Customer Support Services:
Dedicated support services to ensure customer satisfaction and product performance.